HP10 photolithography hotplate

HP10 is suitable for baking substrates in photolithography processes

Stock Status: On The Way


The HP10 photolithography hotplate has a compact design, an all-stainless steel body structure, fast heating speed, and a high-hardness, corrosion-resistant anodized aluminum heating panel that provides a longer service life. The machine has a thermal radiation protection cover, which is particularly suitable for various experimental processes that require high temperature control accuracy and high thermal uniformity.


  • Surface anodized aluminum heating panel, corrosion resistant, high hardness
  • High-precision digital display PID temperature control
  • The heating output is controlled by an independent circuit, which improves the safety of the equipment.
  • The heating structure is submerged in design and is compact in size, suitable for use in the glove box.
  • Thermal radiation cover, heating temperature control up to 300 degree C

[Plate material]: Hard anodized aluminum heating panel,
[Plate size]: 220mm*220mm, can heat 8-inch substrate
[Temperature range]: RT to 300℃
[Heating power]: 1KW
[Temperature control]: High-precision PID control, temperature resolution 0.1℃
[Temperature accuracy]: <±1℃,
[Temperature uniformity]: Working area is less than ±3%
[External dimensions]: 250(W)*270(D)*220(H) mm
We rely on cookies to provide our services. By using our services, you agree to our use of cookies.